Make your product better by using 3D design tools.
Thermal Analysis

Thermal analysis is the process of modeling and studying the thermal behavior of a product or component through analysis and simulation. It involves simulating the heat transfer procedures inside a product or component under various thermal circumstances. Such as conduction, convection, and radiation, using ‘Ansys Simulate’ Extension.

Predicting the temperature distribution inside the product or component and assessing its thermal performance. This includes heat transfer rates, temperature gradients, and thermal stresses, are the two main objectives of thermal analysis.

With this data, the design may be improved, product quality and dependability increased, and product development time and costs decreased. For designing items and parts that must withstand high temperatures, such as electrical gadgets, engines, and aircraft components, thermal analysis is frequently employed.

Thermal Analysis for Design Engineers & Analysts

Thermal analysis is a powerful tool for design engineers and analysts. They can use it to evaluate a product or component’s thermal behavior and improve the design to make sure it can survive the predicted thermal conditions. The design engineers and analysts can gain from the thermal study in the following ways:

 

  • Predict thermal performance
  • Evaluate cooling strategies
  • Optimize material selection
  • Reduce product development time and cost
Features and Capabilities
  • Includes advanced heat transfer modeling tools
  • Includes a material database that provides thermal properties for a range of materials
  • Consists of tools for setting boundary conditions, such as temperature, heat flux, etc.
  • Has a range of solver options
  • Post-processing tools
  • Multi-physics coupling
  • Includes optimization tools
Benefits
  • Improved design of a product
  • Faster development time
  • Reduced costs
  • Improved product performance
  • Reduction in risk
DESIGN AND INNOVATE BETTER WITH CAD
Explore the capabilities of CAD (computer-aided design)
Creo Simulation Live

Creo Simulation Live is a powerful real-time simulation solution that allows engineers and designers to test and validate designs in real-time, reducing design cycle time and improving product accuracy. It offers capabilities like static, modal, and thermal analysis, eliminating the need for assumptions about product performance.

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Creo Ansys Simulation

Creo Ansys Simulation allows engineers and designers to simulate 3D models in real situations, examining stress, vibration, heat transfer, and fluid movement. The simulations guide design choices and enhance product performance. It saves time and money by identifying potential challenges before creating prototypes.

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Structural Analysis

Structural analysis is the assessment of a product’s structural behavior under different loading conditions. It involves designing a virtual model, simulating its behavior using finite element analysis (FEA), and providing insights into stress distribution, deformation, and potential failure modes.

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Thermal Analysis

A simulation-based process that models and studies the thermal behavior of a product or component, aiming to predict temperature distribution and assess thermal performance. This data can improve design, increase product quality and reliability, and reduce development time and costs.

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Modal Analysis

Modal analysis studies a structure’s dynamic behavior under different loading conditions, identifying its native resonance frequencies and mode shapes. This helps detect potential failure modes, improve designs, and ensure a structure can survive anticipated loading conditions.

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Motion Analysis

Motion analysis simulates a mechanism’s motion in a virtual setting, allowing designers and engineers to identify potential issues. Creo Motion Analysis allows users to analyze forces, torques, and velocities to ensure reliable designs, saving time and money in the design process.

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Mold Fill

A crucial tool in Creo that predicts the flow of molten plastic material into a mold during injection molding. It helps designers and engineers optimize the process, ensuring efficient and uniform filling. This analysis helps identify potential issues like seam lines, sink marks, and air traps.

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Fatigue Analysis

Fatigue analysis evaluates a component’s or structure’s behavior under cyclic loading, predicting its capacity to withstand cycles before failure. Engineers simulate loading and unloading cycles on a 3D model, determining stresses and strains and comparing them to the material’s characteristics and fatigue curves.

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Creepage & Clearance

Clearance and creepage are terms in electrical and electronics engineering to describe the distance between conductive parts carrying electrical current or voltage. Clearance is the shortest distance, measured through air or insulating material, preventing short circuits or other electrical hazards.

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Computational Fluid Dynamics (CFD)

Numerical method for simulating fluid flows and heat transfer in systems or products. Engineers can use CFD to analyze design behavior under various variables, such as pressure, temperature, and flow rate, allowing them to optimize performance and obtain precise information.

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